BAS70H.115 Datasheet, PDF (11/20 Pages) NXP Semiconductors – General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.

NXP Semiconductors
10. Soldering
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
1.65 0.95
3.05
2.80
2.10
1.60
0.50 0.60
0.50
(2×)
msa433
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
2.75 1.20
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
2.15
1.20
solder lands
solder paste
solder resist
occupied area
0.30
0.40
1.80
1.90
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
0.50 0.60
mgs343
BAS70_1PS7XSB70_SER_9
Product data sheet
Rev. 09 — 13 January 2010
© NXP B.V. 2010. All rights reserved.
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