OM25180FDKM Datasheet, PDF (113/149 Pages) NXP Semiconductors – High-performance multi-protocol full NFC Forum-compliant frontend

NXP Semiconductors
PN5180
High-performance multi-protocol full NFC Forum-compliant frontend
The system design shall consider that maximum supply voltages are not exceeded during
power-on of the system.
15. Thermal characteristics
Table 112. Thermal characteristics HVQFN40 package
Symbol Parameter
Conditions
Typ
Unit
R_th(j-a)
thermal resistance from junction to in free air with exposed 40
K/W
ambient
pad soldered on a 4
layer JEDEC PCB,
package HVQFN40
Table 113. Thermal characteristics TFBGA64 package
Symbol Parameter
Conditions
Typ
Unit
R_th(j-a)
thermal resistance from junction to in free air with exposed 66
K/W
ambient
pad soldered on a 4
layer JEDEC PCB,
package HVQFN40
Table 114. Junction Temperature
Symbol Parameter
T_j
junction temperature
Conditions
-
Max
Unit
125
°C
16. Characteristics
Table 115. Current consumption
Symbol Parameter
Conditions
Min Typ Max Unit
I_DD(PVDD) supply current on pin PVDD V_DD(PVDD) = 3.3 -
20
-
mA
V
I_DD(VBAT) supply current on pin VBAT V_DD(VBAT) = 3.3 V -
-
20
mA
max current
includes current
of all GPO’s
I_pd
power-down current
VDD(TVDD) = -
10
-
A
VDD(PVDD)
=VDD(VDD) 3.0
V; hard
power-down; pin
RESET_N set
LOW,
T_amb = 25 °C
I_stb
standby current
T_amb = 25 °C
-
15
-
A
PN5180
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.0 — 7 October 2016
240930
© NXP Semiconductors N.V. 2016. All rights reserved.
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