BTA208S-800B_11 Datasheet, PDF (10/14 Pages) NXP Semiconductors – 3Q Hi-Com Triac Triggering in three quadrants only

NXP Semiconductors
8. Soldering
BTA208S-800B
3Q Hi-com Triac
1.00
4.60
5.75 5.65
1.15
3.60
2.45
6.00
2.40 2.30
7.00
6.15
5.90
5.80
1.80
4.725
6.50
6.00
6.125
0.30
solder lands
solder resist
occupied area
solder paste
1.50
4.57
1.30
1.40
1.65
SOT428
Fig 14. Reflow soldering footprint for SOT428 (DPAK)
BTA208S-800B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 14 April 2011
© NXP B.V. 2011. All rights reserved.
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