BCM847BV Datasheet, PDF (10/15 Pages) NXP Semiconductors – NPN/NPN matched double transistors

NXP Semiconductors
11. Soldering
BCM847BV/BS/DS
NPN/NPN matched double transistors
2.75
2.45
2.1
1.6
0.538
2 1.7 1.075
0.55
(2×)
0.4
(6×) ^{0.25 0.3}
(2×) (2×)
1.7
0.45
0.6
(4×)
(2×)
0.5
0.65
(4×)
(2×)
0.325 0.375
(4×) (4×)
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering footprint SOT666
2.65
solder lands
placement area
solder paste
occupied area
Dimensions in mm
sot666_fr
2.35 1.5 0.6 _0.5
(4×) _(4×)
0.4 (2×)
0.5
0.6
(4×)
(2×)
0.6
(4×)
1.8
Fig 15. Reflow soldering footprint SOT363 (SC-88)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot363_fr
BCM847BV_BS_DS_6
Product data sheet
Rev. 06 — 28 August 2009
© NXP B.V. 2009. All rights reserved.
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