LH7A404 Datasheet, PDF (1/75 Pages) NXP Semiconductors – 32-Bit System-on-Chip

Preliminary data sheet
LH7A404
32-Bit System-on-Chip
FEATURES
• 32-bit ARM9TDMI™ RISC Core
– 16 kB Cache: 8 kB Instruction and 8 kB Data Cache
– MMU (Windows CE™ Enabled)
– Up to 266 MHz; See Table 1 for speed options
• 80 kB On-Chip Static RAM
• Vectored Interrupt Controller
• External Bus Interface
– Up to 133 MHz; See Table 1 for bus speed options
– Asynchronous and Synchronous interface RAM,
Flash, PC Card and CompactFlash
• Clock and Power Management
– 32.768 kHz and 14.7456 MHz Oscillators
– Programmable PLL
• Programmable LCD Controller
– Up to 1,024 × 768 Resolution
– Supports STN, Color STN, AD-TFT, HR-TFT, TFT
– Up to 64 K-Colors and 15 Gray Shades
• 9 Channel, 10-bit A/D Converter
– Touch Screen Controller
– Brownout Detector
• DMA (12 Channels)
– External DMA Channels
– AC97
– MMC
– USB
• USB 2.0 Full Speed Host (two downstream ports)
• USB 2.0 Full Speed Device
• Synchronous Serial Port (SSP)
– Motorola SPI™, Texas Instruments SSI, National
Semiconductor MICROWIRE™
• On-board Boot ROM
– Variety of Boot Modes: external ROM, NAND
Flash, Serial EEPROM, or XMODEM
• PS/2 Keyboard/Mouse Interface (KMI)
• Three Programmable Timers
• Three UARTs, one with Classic IrDA (115 kbit/s)
• Smart Card Interface (ISO7816)
• Four Pulse Width Modulators (PWMs)
• MultiMediaCard Interface with Secure Digital
(MMC 2.11/SD 1.0)
• AC97 Codec Interface
• Smart Battery Monitor Interface
• Real Time Clock (RTC)
• Up to 64 General Purpose I/O Channels
• Watchdog Timer
• JTAG Debug Interface and Boundary Scan
• Operating Voltage
– 1.8 V (200 MHz), 2.1 V (266 MHz) Core
– 3.3 V Input/Output (Except XTALIN is 1.8 V)
• 5 V Tolerant Digital Inputs (excludes oscillator pins)
– Oscillator pins T19, T20, Y18, Y19: 1.8 V ± 10 %
• Operating Temperature: −40°C to +85°C
• 324-Ball LFBGA Package
DESCRIPTION
The advent of 3G technology opens up a wide range
of multimedia applications in mobile information appli-
ances. The LH7A404 is designed from the ground up
with a 32-bit ARM922 Core to provide high processing
performance, low power consumption, and a high level
of integration. Features include 80 kB on-chip SRAM,
fully static design, power management unit, low voltage
(1.8 V Core, 3.3 V I/O) and on-chip PLL.
NOTE: Devices containing lead-free solder formulations have differ-
ent reflow temperatures than leaded-solder formulations.
When using both solder formulations on the same PC board,
designers should consider the effect of different reflow tem-
peratures on the overall PCB assembly process. (Refer to
www.nxp.com for an application note on recommended
soldering practices).
Table 1. LH7A404 Versions
PART NUMBER¹ CORE CLOCK BUS CLOCK
LOW POWER CURRENT BY MODE
LH7A404-N0F-092-xx²
LH7A404-N0F-000-xx²
266 MHz
200 MHz
133 MHz
100 MHz
Run = 228 mA (Typ.); Halt = 60 mA (Typ.);
Standby = 200 µA (Typ.)
Run = 147 mA (Typ.); Halt = 41 mA (Typ.);
Standby = 70 µA (Typ.)
NOTES:
1. Where ‘xx’ is a two digit revision number, e.g. B2; refer to
www.NXP.com for a list of all the active revisions
2. Lead-free part.
VERSION
SOT1021-1
SOT1021-1
Preliminary data sheet
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