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AN10365 Datasheet, PDF (1/31 Pages) NXP Semiconductors – Surface mount reflow soldering
AN10365
Surface mount reflow soldering
Rev. 6 — 30 July 2012
Application note
Document information
Info
Content
Keywords
surface mount, reflow soldering, component handling
Abstract
This application note provides guidelines for the board mounting and
handling of NXP semiconductor packages.