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NTE2638 Datasheet, PDF (1/3 Pages) NTE Electronics – Silicon NPN Transistor Darlington
NTE2638
Silicon NPN Transistor
Darlington
Features:
D High Voltage, High Forward and Clamped Reverse Energy
D 10A Peak Collector Current
D 80W at +25°C Case Temperature
D Collector–Emitter Sustaining Voltage: 400V Min at 7A
Absolute Maximum Ratings: (TC = +25°C unless otherwise specifieid)
Collector–Emitter Voltage (IB = 0), VCEO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V
Collector–Base Voltage, VCBO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V
Emitter–Base Voltage, VEBO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V
Collector Current, IC
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7A
Peak (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10A
Continuous Base Current, IB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A
Continuous Device Dissipation (TC = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80W
Derate Linearly to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.64W/°C
Continuous Device Dissipation (TA = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2W
Derate Linearly to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16mW/°C
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +150°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +150°C
Thermal Resistance, Junction–to–Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.56°C/W
Thermal Resistance, Junction–to–Ambient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.5°C/W
Typical Thermal Resistance, Case–to–Heat Sink (Note 2), RthCHS . . . . . . . . . . . . . . . . . . . . 0.7°C/W
Lead Temperature (During Soldering, 1/8” from case, 10sec), TL . . . . . . . . . . . . . . . . . . . . . . +260°C
Note 1. This value applies for tw ≤ 5ms, duty cycle ≤ 10%.
Note 2. This parameter is measured using 0.003” (0.08mm) mica insulator with Dow–Corning 11
compound on both sides of the insulator, a 0.138–32 (formally 6–32) mounting screw with
bushing, and a mounting torque of 8 in•lb (0.9 n•m).