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LP38842-ADJ Datasheet, PDF (7/8 Pages) National Semiconductor (TI) – 1.5A Ultra Low Dropout Adjustable Linear Regulators Stable with Ceramic Output Capacitors
Application Hints
SETTING THE OUTPUT VOLTAGE
(Refer to Typical Application Circuit)
The output voltage is set using the resistive divider R1 and
R2. The output voltage is given by the formula:
VOUT = VADJ x (1 + R1 / R2)
The value of resistor R2 must be 10k or less for proper
operation.
EXTERNAL CAPACITORS
To assure regulator stability, input and output capacitors are
required as shown in the Typical Application Circuit.
OUTPUT CAPACITOR
An output capacitor is required on the LP3884X devices for
loop stability. The minimum value of capacitance necessary
depends on type of capacitor: if a solid Tantalum capacitor is
used, the part is stable with capacitor values as low as 4.7µF.
If a ceramic capacitor is used, a minimum of 22 µF of
capacitance must be used (capacitance may be increased
without limit). The reason a larger ceramic capacitor is re-
quired is that the output capacitor sets a pole which limits the
loop bandwidth. The Tantalum capacitor has a higher ESR
than the ceramic which provides more phase margin to the
loop, thereby allowing the use of a smaller output capacitor
because adequate phase margin can be maintained out to a
higher crossover frequency. The tantalum capacitor will typi-
cally also provide faster settling time on the output after a
fast changing load transient occurs, but the ceramic capaci-
tor is superior for bypassing high frequency noise.
The output capacitor must be located less than one centi-
meter from the output pin and returned to a clean analog
ground. Care must be taken in choosing the output capacitor
to ensure that sufficient capacitance is provided over the full
operating temperature range. If ceramics are selected, only
X7R or X5R types may be used because Z5U and Y5F types
suffer severe loss of capacitance with temperature and ap-
plied voltage and may only provide 20% of their rated ca-
pacitance in operation.
INPUT CAPACITOR
The input capacitor is also critical to loop stability because it
provides a low source impedance for the regulator. The
minimum required input capacitance is 10 µF ceramic (Tan-
talum not recommended). The value of CIN may be in-
creased without limit. As stated above, X5R or X7R must be
used to ensure sufficient capacitance is provided. The input
capacitor must be located less than one centimeter from the
input pin and returned to a clean analog ground.
FEED FORWARD CAPACITOR
(Refer to Typical Application Circuit)
A capacitor placed across R1 can provide some additional
phase margin and improve transient response. The capaci-
tor CFF and R1 form a zero in the loop response given by the
formula:
FZ = 1 / (2 x π x CFF x R1)
For best effect, select CFF so the zero frequency is approxi-
mately 70 kHz. The phase lead provided by CFF drops as the
output voltage gets closer to 0.56V (and R1 reduces in
value). The reason is that CFF also forms a pole whose
frequency is given by:
FP = 1 / (2 x π x CFF x R1 // R2)
As R1 reduces, the two equations come closer to being
equal and the pole and zero begin to cancel each other out
which removes the beneficial phase lead of the zero.
BIAS CAPACITOR
The 0.1µF capacitor on the bias line can be any good quality
capacitor (ceramic is recommended).
BIAS VOLTAGE
The bias voltage is an external voltage rail required to get
gate drive for the N-FET pass transistor. Bias voltage must
be in the range of 4.5 - 5.5V to assure proper operation of
the part.
UNDER VOLTAGE LOCKOUT
The bias voltage is monitored by a circuit which prevents the
regulator output from turning on if the bias voltage is below
approximately 3.8V.
SHUTDOWN OPERATION
Pulling down the shutdown (S/D) pin will turn-off the regula-
tor. The S/D pin must be actively terminated through a
pull-up resistor (10 kΩ to 100 kΩ) for a proper operation. If
this pin is driven from a source that actively pulls high and
low (such as a CMOS rail to rail comparator), the pull-up
resistor is not required. This pin must be tied to Vin if not
used.
POWER DISSIPATION/HEATSINKING
Heatsinking for the PSOP-8 package is accomplished by
allowing heat to flow through the ground slug on the bottom
of the package into the copper on the PC board. The heat
slug must be soldered down to a copper plane to get good
heat transfer. It can also be connected through vias to inter-
nal copper planes. Since the heat slug is at ground potential,
traces must not be routed under it which are not at ground
potential. Under all possible conditions, the junction tem-
perature must be within the range specified under operating
conditions.
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