MNLMH6628-X-RH Datasheet, PDF (3/12 Pages) National Semiconductor (TI) – DUAL WIDEBAND, LOW-NOISE, VOLTAGE FEEDBACK OP AMP, GUARANTEED TO 300k rd (si) TESTED TO MIL-STD-883, METHOD 1019

MNLMH6628-X-RH REV 0A0
MICROCIRCUIT DATA SHEET
(Absolute Maximum Ratings)
(Note 1)
Supply Voltage
Maximum Junction temperature
(Note 2)
Lead temperature
Soldering, 10 seconds
Differential input voltage
Common mode input voltage
Storage temperature range
Power Dissipation
(Note 2)
Short circuit current
(Note 3)
+7V dc
+175 C
+300 C
V+ - V-
V+ - V-
-65 C < Ta < +150 C
1.0W
Thermal Resistance
ThetaJA
Ceramic DIP
Ceramic SOIC
ThetaJC
Ceramic DIP
Ceramic SOIC
Package Weight
(typical)
Ceramic DIP
Ceramic SOIC
ESD Tolerance
(Note 4)
(Still Air)
(500LF/Min Air Flow)
(Still Air)
(500LF/Min Air Flow)
135 C/W
75 C/W
200 C/W
145 C/W
30 C/W
19 C/W
TBD
TBD
4000V
Note 1:
Note 2:
Note 3:
Note 4:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Operating Ratings indicate conditions for which the device is intended to be
functional, but do not guarantee specific performance limits. For guaranteed
specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test
conditions.
The maximum power dissipation must be derated at elevated temperatures and is
dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to
ambient thermal resistance), and TA (ambient temperatuer). The maximum allowable
power dissipation at any temperatuer is Pdmax = (Tjmax -TA) / ThetaJA or the number
given in the Absoulute Maximum Ratings, whichever is lower.
Output is short circuit protected to ground, however maximum reliability is obtained
if output current does not exceed 160mA.
Human body model, 1.5k Ohms in series with 100pF.
3