DAC128S085 Datasheet, PDF (3/24 Pages) National Semiconductor (TI) – 12-Bit Micro Power OCTAL Digital-to-Analog Converter with Rail-to-Rail Outputs

Pin Configuration
Pin Descriptions
LLP
Pin No.
1
2
3
4
5
6
TSSOP
Pin No.
3
4
5
6
7
8
Symbol
V_OUTA
V_OUTB
V_OUTC
V_OUTD
V_A
V_REF1
7
9
8
10
9
11
10
12
11
13
12
14
V_REF2
GND
V_OUTH
V_OUTG
V_OUTF
V_OUTE
13
15
SYNC
14
16
15
1
SCLK
D_IN
16
2
D_OUT
17
PAD
(LLP only)
30016901
30016902
Type
Analog Output
Analog Output
Analog Output
Analog Output
Supply
Analog Input
Analog Input
Ground
Analog Output
Analog Output
Analog Output
Analog Output
Digital Input
Digital Input
Digital Input
Digital Output
Ground
Description
Channel A Analog Output Voltage.
Channel B Analog Output Voltage.
Channel C Analog Output Voltage.
Channel D Analog Output Voltage.
Power supply input. Must be decoupled to GND.
Unbuffered reference voltage shared by Channels A, B, C, and D.
Must be decoupled to GND.
Unbuffered reference voltage shared by Channels E, F, G, and H.
Must be decoupled to GND.
Ground reference for all on-chip circuitry.
Channel H Analog Output Voltage.
Channel G Analog Output Voltage.
Channel F Analog Output Voltage.
Channel E Analog Output Voltage.
Frame Synchronization Input. When this pin goes low, data is
written into the DAC's input shift register on the falling edges of
SCLK. After the 16th falling edge of SCLK, a rising edge of SYNC
causes the DAC to be updated. If SYNC is brought high before the
15th falling edge of SCLK, the rising edge of SYNC acts as an
interrupt and the write sequence is ignored by the DAC.
Serial Clock Input. Data is clocked into the input shift register on
the falling edges of this pin.
Serial Data Input. Data is clocked into the 16-bit shift register on
the falling edges of SCLK after the fall of SYNC.
Serial Data Output. D_OUT is utilized in daisy chain operation and is
connected directly to a D_IN pin on another DAC128S085. Data is
not available at D_OUT unless SYNC remains low for more than 16
SCLK cycles.
Exposed die attach pad can be connected to ground or left floating.
Soldering the pad to the PCB offers optimal thermal performance
and enhances package self-alignment during reflow.
3
www.national.com