THS4131 Datasheet, PDF (29/37 Pages) National Semiconductor (TI) – HIGH-SPEED, LOW-NOISE, FULLY-DIFFERENTIAL I/O AMPLIFIERS

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PACKAGE MATERIALS INFORMATION
13-Mar-2014
*All dimensions are nominal
Device
Package Type Package Drawing Pins
THS4130CDGNR
MSOP-PowerPAD
DGN
8
THS4130IDGKR
VSSOP
DGK
8
THS4130IDGNR
MSOP-PowerPAD
DGN
8
THS4130IDR
THS4131CDGKR
SOIC
VSSOP
D
8
DGK
8
THS4131CDGNR
MSOP-PowerPAD
DGN
8
THS4131CDR
THS4131IDGKR
SOIC
VSSOP
D
8
DGK
8
THS4131IDGNR
MSOP-PowerPAD
DGN
8
THS4131IDR
SOIC
D
8
SPQ
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
Length (mm)
364.0
358.0
364.0
367.0
358.0
364.0
367.0
358.0
364.0
367.0
Width (mm)
364.0
335.0
364.0
367.0
335.0
364.0
367.0
335.0
364.0
367.0
Height (mm)
27.0
35.0
27.0
35.0
35.0
27.0
35.0
35.0
27.0
35.0
Pack Materials-Page 2