THS4131 Datasheet, PDF (28/37 Pages) National Semiconductor (TI) – HIGH-SPEED, LOW-NOISE, FULLY-DIFFERENTIAL I/O AMPLIFIERS

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TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
13-Mar-2014
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
THS4130CDGNR
THS4130IDGKR
THS4130IDGNR
THS4130IDR
THS4131CDGKR
THS4131CDGNR
THS4131CDR
THS4131IDGKR
THS4131IDGNR
THS4131IDR
MSOP- DGN 8
Power
PAD
VSSOP DGK 8
MSOP- DGN 8
Power
PAD
SOIC
D
8
VSSOP DGK 8
MSOP- DGN 8
Power
PAD
SOIC
D
8
VSSOP DGK 8
MSOP- DGN 8
Power
PAD
SOIC
D
8
SPQ
2500
Reel Reel A0
Diameter Width (mm)
(mm) W1 (mm)
330.0 12.4 5.3
B0
(mm)
3.4
K0
(mm)
1.4
P1
(mm)
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0
Q1
2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0
Q1
2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0
Q1
2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0
Q1
2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0
Q1
2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0
Q1
2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0
Q1
2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0
Q1
2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0
Q1
Pack Materials-Page 1