LP3958 Datasheet, PDF (28/28 Pages) National Semiconductor (TI) – Lighting Management Unit with High Voltage Boost Converter

Physical Dimensions inches (millimeters) unless otherwise noted
The dimension for X1 ,X2 and X3 are as given:
• X1=2.543mm ± 0.03mm
• X2=2.543mm ± 0.03mm
• X3=0.60mm ± 0.075mm
25-bump micro SMD Package, 2.54 x 2.54 x 0.6mm, 0.5mm pitch
NS Package Number TLA25CCA
See Application note AN–1112 for PCB design and assembly instructions.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
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