THS4121 Datasheet, PDF (23/31 Pages) National Semiconductor (TI) – HIGH-SPEED FULLY DIFFERENTIAL I/O AMPLIFIERS

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PACKAGE MATERIALS INFORMATION
13-Mar-2014
*All dimensions are nominal
Device
Package Type Package Drawing Pins
THS4120CDGNR
MSOP-PowerPAD
DGN
8
THS4120IDGNR
MSOP-PowerPAD
DGN
8
THS4120IDR
SOIC
D
8
THS4121CDGKR
VSSOP
DGK
8
THS4121CDGNR
MSOP-PowerPAD
DGN
8
THS4121IDGKR
VSSOP
DGK
8
THS4121IDGNR
MSOP-PowerPAD
DGN
8
SPQ
2500
2500
2500
2500
2500
2500
2500
Length (mm)
358.0
358.0
367.0
358.0
358.0
358.0
364.0
Width (mm)
335.0
335.0
367.0
335.0
335.0
335.0
364.0
Height (mm)
35.0
35.0
35.0
35.0
35.0
35.0
27.0
Pack Materials-Page 2