TL082CMX Datasheet, PDF (2/3 Pages) National Semiconductor (TI) – Engineering Project Manager

Banned Substance Monitoring
Part Number
TL082CMX
Document Date
29-Dec-2007
Contains Lead(Pb) and is NOT European RoHS Compliant.
NOT China RoHS Compliant
Use
Material
Cd
CrVl
Pb
Hg
Device
CHIP
<1
<1
<1
<1
COMPOUND
<2
<2
<2
<2
EPOXY
<2
<5
<5
<1
EXTLF
<2
<2
149000
<2
FRAME
<2
<2
15
<2
WIRE
<2
<5
<5
<1
* Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected
* Unless otherwise noted, units are in PPM (parts-per-million)
PBB
<1
<100
<10
NA
NA
<10
PBDE
<1
<100
<10
NA
NA
<10
Ref #
1000
637
32
56
53
75
Ref #
1000
32
53
56
75
637
3rd Party Analysis (available upon request, subject to a non-disclosure agreement)
Analysis on 04/17/2007 by Balazs Analytical Services-Freemont CA per Report# 07-01051-07
Analysis on 05/16/2007 by ALS per Report# ATJB/3488BS/2007
Analysis on 03/13/2007 by SGS per Report# LPCI/05143/07
Analysis on 04/27/2007 by SGS per Report# LPCI/07440/07
Analysis on 05/16/2007 by ALS per Report# ATJB/3490BS/2007
Analysis on 06/04/2007 by SGS per Report# LPCI/10324/07
National Semiconductor
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