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LMH6704_14 Datasheet, PDF (2/20 Pages) National Semiconductor (TI) – MHz Selectable Gain Buffer with Disable
LMH6704
SNOSAD0C – FEBRUARY 2005 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
ESD Tolerance (2)
Human Body Model
Machine Model
Supply Voltage
IOUT
Common-Mode Input Voltage
Maximum Junction Temperature
Storage Temperature Range
Infrared or Convection (20 sec.)
Soldering Information
Wave Soldering (10 sec.)
Lead Temp. (soldering 10 sec.)
2000V
200V
13.5V
(3)
VS− to VS+
150°C
−65°C to 150°C
235°C
260°C
300°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3) The maximum output current (IOUT) is determined by device power dissipation limitations.
Operating Ratings(1)
Nominal Supply Voltage
Temperature Range (2)
Thermal Resistance
Package
8-Pin SOIC
6-Pin SOT23
(θJC)
75°C/W
120°C/W
±4V to ±6V
−40°C to 85°C
(θJA)
160°C/W
187°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
2
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