LMH6611_14 Datasheet, PDF (2/42 Pages) National Semiconductor (TI) – LMH6611/LMH6612 Single Supply 345 MHz Rail-to-Rail Output Amplifiers

LMH6611, LMH6612
SNOSB00K – NOVEMBER 2007 – REVISED OCTOBER 2013
www.ti.com
DESCRIPTION (CONTINUED)
The amplifiers will operate on a 2.7V to 11V single supply or ±1.35V to ±5.5V split supply. The LMH6611 single
is available in 6-Pin SOT and has an independent active low disable pin which reduces the supply current to 120
µA. The LMH6612 is available in 8-Pin SOIC. Both the LMH6611 and LMH6612 are available in −40°C to
+125°C extended industrial temperature grade.
Typical Application
R₁
1 PF 549:
IN
R₅
1.24 k:
5V
1 PF
GND
V⁺
0.1 PF
0.01 PF
R6
14.3 k:
C₂
1 nF
R₇
14.3 k:
5.6 PF
0.1 PF
R₂
549:
C₅
150 pF
V⁺
0.1 PF
-
LMH6611
+
U1
10 PF
R_L
22:
C_L
390 pF
V⁺
0.1 PF 10 PF
ADC121S101
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
ESD Tolerance⁽³⁾
Supply Voltage (V_S = V⁺ – V^−)
Junction Temperature⁽⁴⁾
Human Body Model
Machine Model
Charge Device Model
For input pins only
For all other pins
2000V
2000V
200V
1000V
12V
150°C max
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX)) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings⁽¹⁾
Supply Voltage (V_S = V⁺ – V^−)
Ambient Temperature Range⁽²⁾
Package Thermal Resistance (θ_JA)
6-Pin SOT
8-Pin SOIC
2.7V to 11V
−40°C to +125°C
231°C/W
160°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX)) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
2
Submit Documentation Feedback
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMH6611 LMH6612