DS90LV018A_05 Datasheet, PDF (2/9 Pages) National Semiconductor (TI) – 3V LVDS Single CMOS Differential Line Receiver

Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V_CC)
−0.3V to +4V
Input Voltage (R_IN+, R_IN−)
−0.3V to +3.9V
Output Voltage (R_OUT)
−0.3V to (V_CC + 0.3V)
Maximum Package Power Dissipation @ +25˚C
M Package
1025 mW
Derate M Package
8.2 mW/˚C above +25˚C
Storage Temperature Range
−65˚C to +150˚C
Lead Temperature Range Soldering
(4 sec.)
+260˚C
Maximum Junction Temperature
ESD Rating (Note 4)
(HBM 1.5 kΩ, 100 pF)
(EIAJ 0Ω, 200 pF)
+150˚C
≥ 7 kV
≥ 500 V
Recommended Operating
Conditions
Min Typ Max
Supply Voltage (V_CC)
Receiver Input Voltage
+3.0 +3.3 +3.6
GND
3.0
Operating Free Air
Temperature (T_A)
−40 25 +85
Units
V
V
˚C
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3)
Symbol
Parameter
Conditions
Pin Min
V_TH
Differential Input High Threshold V_CM = +1.2V, 0V, 3V (Note 11)
V_TL
Differential Input Low Threshold
I_IN
Input Current
V_IN = +2.8V V_CC = 3.6V or 0V
V_IN = 0V
V_IN = +3.6V V_CC = 0V
V_OH
Output High Voltage
I_OH = −0.4 mA, V_ID = +200 mV
I_OH = −0.4 mA, Inputs terminated
I_OH = −0.4 mA, Inputs shorted
V_OL
Output Low Voltage
I_OL = 2 mA, V_ID = −200 mV
I_OS
Output Short Circuit Current
V_OUT = 0V (Note 5)
V_CL
Input Clamp Voltage
I_CL = −18 mA
I_CC
No Load Supply Current
Inputs Open
R_IN+,
R_IN−
R_OUT
−100
−10
−10
-20
2.7
2.7
2.7
−15
−1.5
V_CC
Typ
±1
±1
3.1
3.1
3.1
0.3
−50
−0.8
5.4
Max
+100
+10
+10
+20
0.5
−100
9
Units
mV
mV
µA
µA
µA
V
V
V
V
mA
V
mA
Switching Characteristics
V_CC = +3.3V ± 10%, T_A = −40˚C to +85˚C (Notes 6, 7)
Symbol
Parameter
t_PHLD
t_PLHD
t_SKD1
t_SKD3
t_SKD4
t_TLH
t_THL
f_MAX
Differential Propagation Delay High to Low
Differential Propagation Delay Low to High
Differential Pulse Skew |t_PHLD − t_PLHD| (Note 8)
Differential Part to Part Skew (Note 9)
Differential Part to Part Skew (Note 10)
Rise Time
Fall Time
Maximum Operating Frequency (Note 12)
Conditions
Min Typ Max Units
C_L = 15 pF
1.0 1.6 2.5 ns
V_ID = 200 mV
1.0 1.7 2.5 ns
(Figure 1 and Figure 2) 0
50 400 ps
0
1.0 ns
0
1.5 ns
325 800 ps
225 800 ps
200 250
MHz
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise
specified (such as V_ID).
Note 3: All typicals are given for: V_CC = +3.3V and T_A = +25˚C.
Note 4: ESD Rating: HBM (1.5 kΩ, 100 pF) ≥ 7 kV
EIAJ (0Ω, 200 pF) ≥ 500V
Note 5: Output short circuit current (I_OS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not
exceed maximum junction temperature specification.
Note 6: C_L includes probe and jig capacitance.
Note 7: Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z_O = 50Ω, t_r and t_f (0% to 100%) ≤ 3 ns for R_IN.
Note 8: t_SKD1 is the magnitude difference in differential propagation delay time between the positive-going-edge and the negative-going-edge of the same channel.
Note 9: t_SKD3, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same V_CC
and within 5˚C of each other within the operating temperature range.
www.national.com
2