THS6072 Datasheet, PDF (19/31 Pages) Texas Instruments – LOW-POWER ADSL DIFFERENTIAL RECEIVER

THS6072
LOW-POWER ADSL DIFFERENTIAL RECEIVER
SLOS290B – FEBRUARY 2000 – REVISED JUNE 2001
APPLICATION INFORMATION
general PowerPAD design considerations (continued)
The actual thermal performance achieved with the THS6072DGN in its PowerPAD package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches × 3 inches,
then the expected thermal coefficient, θ_JA, is about 58.4_C/W. For comparison, the non-PowerPAD version of
+ ǒ Ǔ ^{the THS6072 IC (SOIC) is shown. For a given θJA, the maximum power dissipation is shown in Figure 47 and}
is calculated by the following formula:
PD
TMAX–TA
q_JA
Where:
P_D = Maximum power dissipation of THS6072 IC (watts)
T_MAX = Absolute maximum junction temperature (150°C)
T_A = Free-ambient air temperature (°C)
θ_JA = θ_JC + θ_CA
θ_JC = Thermal coefficient from junction to case
θ_CA = Thermal coefficient from case to ambient air (°C/W)
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
DGN Package
θ_JA = 58.4°C/W
TJ = 150°C
3
2 oz. Trace And Copper Pad
With Solder
2.5
SOIC Package
High-K Test PCB
2 ^θJA ^{= 98°C/W}
DGN Package
θ_JA = 158°C/W
2 oz. Trace And
Copper Pad
Without Solder
1.5
1
0.5 ^{SOIC Package}
Low-K Test PCB
θ_JA = 167°C/W
0
–40 –20 0 20 40 60 80 100
TA – Free-Air Temperature – °C
NOTE A: Results are with no air flow and PCB size = 3”× 3”
Figure 47. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package. This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
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