LMC6035 Datasheet, PDF (19/20 Pages) National Semiconductor (TI) – Low Power 2.7V Single Supply CMOS Operational Amplifiers

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NOTE: UNLESS OTHERWISE SPECIFIED.
1. EPOXY COATING.
2. 63Sn/37Pb EUTECTIC BUMP.
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION PINS ARE NUMBERED COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD (6 mil bumps)
NS Package Number BPA08FFB
X₁ = 1.412mm X₂ = 1.412mm X₃ = 0.850mm
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