CF5019 Datasheet, PDF (2/12 Pages) Nippon Precision Circuits Inc – High-Frequency, 3rd Overtone Crystal Oscillator Module ICs

PAD LAYOUT
(Unit: µm)
CF5019 series
VDD
(900,1050)
Q
Y
NPC
INHN
VSS
(0,0)
XT XTN
X
Chip size: 0.9 × 1.05mm
Chip thickness: 220µm ± 30µm
PAD size: 90µm
Chip base: V_DD level
PIN DESCRIPTION and PAD DIMENSIONS
Name
INHN
XT
XTN
VSS
Q
VDD
I/O
Description
I
Output state control input. High impedance when LOW (oscillator stops).
Power-saving pull-up resistor built-in.
I
Amplifier input
O
Amplifier output
Crystal connection pins.
Crystal is connected between XT and XTN.
–
(–) ground
O
Output
–
(+) supply voltage
BLOCK DIAGRAM
XTN
CG
VDD VSS
CD
Rf 1
Cf
RD
XT
Rf 2
Pad dimensions [µm]
X
Y
144.6
190.6
347.8
560.6
755.4
755.4
151.4
171
171
497.8
905.4
918.2
Q
INHN
INHN = LOW active
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