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NSSU100D Datasheet, PDF (8/14 Pages) NICHIA CORPORATION – SPECIFICATIONS FOR NICHIA CHIP TYPE UV LED
Nichia STS-DA1-1207
<Cat.No.100831>
(7) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Pre-heat
120 ~ 150°C
180 ~ 200°C
Temperature 350°C Max.
Pre-heat time 120 sec. Max.
120 sec. Max.
Soldering time 3 sec. Max.
Peak
240°C Max.
260°C Max.
(one time only)
temperature
Soldering time 10 sec. Max.
10 sec. Max.
Condition
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
<1 : Lead Solder>
2.5 ~ 5°C / sec.
240°C Max.
Pre-heating
10sec. Max.
2.5 ~ 5°C / sec. 120 ~ 150°C 60sec.Max.
Above 200°C
Use the conditions shown to the under figure.
<2 : Lead-free Solder>
1 ~ 5°C / sec.
260°C Max.
Pre-heating
10sec. Max.
1 ~ 5°C / sec. 180 ~ 200°C 60sec.Max.
Above 220°C
120sec.Max.
[Recommended soldering pad design]
120sec.Max.
Use the following conditions shown in the figure.
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the customer use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
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