NSSU100D Datasheet, PDF (7/14 Pages) NICHIA CORPORATION – SPECIFICATIONS FOR NICHIA CHIP TYPE UV LED

Nichia STS-DA1-1207
<Cat.No.100831>
(6) LED position and orientation
· Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs.
Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist
and warpage of the board.
【Non-preferable】
Cathode mark
【Preferable】
Cathode mark
When mechanical stress from the board affects the soldered LED, place the LED in the preferable
location and orientation as shown above.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
Perforated line
ï¼¥
ï¼£
Ｄ
ï¼¢
Ａ
Slit
Stress : A > B = C > D > E
· When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment.
Hand brake without these tools and equipment may not be used.
· The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and
subsequently may result in solder joint crack. Customers may need to evaluate their specific
application to determine any impact due to the use of aluminum substrate.
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