NSPW500DS_14 Datasheet, PDF (6/16 Pages) NICHIA CORPORATION – SPECIFICATIONS FOR WHITE LED

SOLDERING
NICHIA STS-DA1-1477A <Cat.No.110318>
• Hand Soldering
Temperature
Soldering Time
Position
350°C Max
3sec Max
No closer than 3mm from
the base of the lens.
• Dip Soldering
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
120°C Max
60sec Max
260°C Max
10sec Max
No closer than 3mm from
the base of the lens.
* For a better thermal performance, copper alloy is used for the leadframe of the product.
Care must be taken for the soldering conditions and handling of the products after soldering.
* Solder the LED no closer than 3mm from the base of the lens.
Soldering beyond the base of the tie bar is recommended.
* Dip soldering and manual soldering must only be done once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* Do not apply any stress to the lead particularly when heated.
* After soldering, the LED position must not be corrected.
* After soldering, NO mechanical shock or vibration should be applied to LED lens
until the LEDs cool down to room temperature.
* In order to avoid damage on the lens during cutting and clinching the leads,
it is not recommended to solder the LEDs directly on customer PCB without any gap between the lens and the board.
If it is unavoidable, customer is advised to check whether such soldering will not cause wire breakage or lens damage.
Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the lens.
* When it is necessary to clamp the LEDs to prevent soldering failure,
it is important to minimize the mechanical stress on the LEDs.
* Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.
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