NSPW500DS_14 Datasheet, PDF (14/16 Pages) NICHIA CORPORATION – SPECIFICATIONS FOR WHITE LED

CAUTIONS
NICHIA STS-DA1-1477A <Cat.No.110318>
(1) Lead Forming
● When forming leads, the leads should be bent at a point at lease 3mm from the base of the epoxy bulb.
Do not use the base of the leadframe as a fulcrum during lead forming.
● Lead forming should be done before soldering.
● Do not apply any bending stress to the base of the lead.
The stress to the base may damage the LED's characteristics or it may break the LEDs.
● When mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned
with the lead pitch of the product. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin
and this will degrade the LEDs.
(2) Storage
● Shelf life of the products in unopened bag is 3 months(max.) at <30°C and 70% RH from the delivery date.
If the shelf life exceeds 3 months or more, the LEDs need to be stored in a sealed container with desiccant (silica gel)
to ensure their shelf life will not exceed 1 year.
● Nichia LED leadframe are silver plated copper alloy. This silver surface may be affected by environments
which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor.
This corrosion or discoloration may cause difficulty during soldering operation.
It is recommended that the LEDs be used as soon as possible.
● To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.
(3) Directions for Use
● In designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating specified for each LED.
It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile,
when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
(A)
(B)
● This product should be operated in forward bias. A driving circuit must be designed
so that the product is not subjected to either forward or reverse voltage while it is off. In particular,
if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage.
● For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or higher.
● Care must be taken to ensure that the reverse voltage will not exceed the Absolute Maximum Rating
when using the LEDs with matrix drive.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
(4) Handling Precautions
● When handling the product, do not touch it directly with bare hands as it may contaminate the surface
and affect on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure
due to package damage and/or wire breakage.
● If the product is dropped, it might be damaged.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.
(5) Design Consideration
● PCB warpage after mounting the products onto a PCB can cause the package to break.
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
● Board separation must be performed using special jigs, not with hands.
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