NS4L107T Datasheet, PDF (11/18 Pages) NICHIA CORPORATION – WARM WHITE LED

Nichia STS-DA1-0204
<Cat.No.080513>
(6) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip or hand soldering method.
· Recommended soldering conditions
Reflow Soldering
Lead Solder
Lead-free Solder
Pre-heat
120 ~ 150°C
180 ~ 200°C
Pre-heat time 120 sec. Max.
120 sec. Max.
Peak
240°C Max.
260°C Max.
temperature
Soldering time 10 sec. Max.
10 sec. Max.
Condition
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N₂ reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
240°C Max.
Pre-heating
10sec. Max.
120 ~ 150°C _60sec.Max.
Above 200°C
1 ~ 5°C / sec.
1 ~ 5°C / sec.
260°C Max.
Pre-heating
10sec. Max.
180 ~ 200°C _60sec.Max.
Above 220°C
120sec.Max.
[Recommended soldering pad design]
4.0
2.8
120sec.Max.
Use the following conditions shown in the figure.
(Unit : mm)
1.8
4-R0.3
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Die Heat sink is to be soldered.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
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