N-HFA30PA40C Datasheet, PDF (2/5 Pages) Nell Semiconductor Co., Ltd – FRED Ultrafast Soft Recovery Diode, 2 x 15 A

SEMICONDUCTOR
N-HFA30PA40C ^RRooHHSS
Nell High Power Products
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Cathode to anode
breakdown voltage
V_BR
Maximum forward voltage
V_FM
Maximum reverse
I_RM
leakage current
Junction capacitance
C_T
Series inductance
L_S
(T_J = 25 ºC unless otherwise specified)
TEST CONDITIONS
MIN.
I_R = 100 µA
400
I_F = 15 A
-
I_F = 30 A
-
I_F = 15 A, T_J = 125 ºC
-
V_R = V_R rated
-
T_J = 125°C, V_R = V_R rated
-
V_R = 200V
-
Measured lead to lead 5 mm from package body
-
TYP.
-
1.3
1.6
1.2
-
-
25
12
MAX. UNITS
-
1.5
V
-
-
50
µA
500
50
pF
-
nH
DYNAMIC RECOVERY CHARACTERISTICS PERLEG (T_J = 25 ºC unless otherwise specified)
PARAMETER
SYMB OL
TEST CONDITIONS
MIN.
TYP. MAX.
Reverse recovery time
I_F = 0.5A, I_R = 1.0A, I_RR = 250mA (RG#1 CKT)
-
t_rr
I_F = 1.0 A, dI_F/dt = -100 A/µs, V_R =30 V, T_J = 25°C
-
t_rr1
T_J = 25 ºC
-
28
35
19
-
35
60
Peak recovery current
Reverse recovery charge
t_rr2
I_RRM1
I_RRM2
Q_rr1
Q_rr2
T_J = 125 ºC
T_J = 25 ºC
T_J = 125 ºC
T_J = 25 ºC
T_J = 125 ºC
-
I_F= 15A
-
dI_F/dt = -200 A/µs
-
V_R = 266 V
-
95
120
3
6.0
6
10
60
180
-
300
600
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS PER LEG
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Junction to case,
single leg conduction
Junction to case,
both legs conducting
T_lead
0.063'' from case (1.6 mm) for 10 s
R_thJC
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
R_thJA
R_thCS
Typical socket mount
Mounting surface, flat, smooth and greased
Weight
Mounting torque
Marking device
Case style TO-247AB (JEDEC)
MIN.
-
-
-
-
-
-
-
6.0
(5.0)
TYP.
-
-
MAX.
300
1.40
UNITS
°C
-
0.70
K/W
-
40
0.25
-
6.0
-
0.21
-
12
-
(10)
HFA30PA40C
g
oz.
kgf . cm
(lbf . in)
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