UPG152TA Datasheet, PDF (8/12 Pages) NEC – L-BAND SPDT SWITCH

P_PG152TA
RECOMMENDED SOLDERING CONDITIONS
This Product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process
Infrared ray reflow
VPS
Wave Soldering
Pin part heating
Soldering conditions
Package peak temperature: 235 °C
Hour: within 30 s. (more than 210 °C)
Time: 3 times, Limited days: no.^Note
Package peak temperature: 215 °C
Hour: within 40 s. (more than 200 °C)
Time: 3 times, Limited days: no.^Note
Soldering tub temperature: less than 260 °C, Hour: within 10 s.
Time: 1 time, Limited days: no.^Note
Pin area temperature: less than 300 °C, Hour: within 3 s.
Limited days: no.^Note
Recommended condition
symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 %, RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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