UPG2121TB Datasheet, PDF (7/8 Pages) NEC – L-BAND UP/DOWN CONVERTER

µPG2121TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None^Note
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None^Note
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None^Note
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None^Note
Recommended Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Preliminary Data Sheet P15014EJ1V0DS00
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