UPG138GV Datasheet, PDF (7/8 Pages) NEC – L-BAND SPDT SWITCH

P_PG138GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
[PPG138GV]
Soldering process
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering conditions
Package peak temperature: 235 qC
Hour: within 30 s. (more than 210 qC)
Time: 3 times, Limited days: no.^Note
Package peak temperature: 215 qC
Hour: within 40 s. (more than 200 qC)
Time: 3 times, Limited days: no.^Note
Soldering tub temperature: less than 260 qC, Hour: within 10 s.
Time: 1 time, Limited days: no.^Note
Pin area temperature: less than 300 qC, Hour: within 10 s.
Limited days: no.^Note
Recommended condition symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note It is storage days after opening a dry pack, the storage conditions are 25 qC, less than 65 %, RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
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