UPG139GV Datasheet, PDF (6/8 Pages) NEC – L-BAND DPDT MMIC SWITCH

µPG139GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process
Infrared Ray Reflow
VPS
Wave Soldering
Partial Heating Method
Soldering Conditions
Peak package’s surface temperature: 235°C or below
Reflow time: 30 seconds or less (at 210°C)
Number of reflow process: 3, Exposure limit^Note: None
Peak package’s surface temperature: 215°C or below
Reflow time: 40 seconds or less (at 200°C)
Number of reflow process: 3, Exposure limit^Note: None
Solder temperature: 260°C or below
Flow time: 10 seconds or less
Number of flow process: 1, Exposure limit^Note: None
Terminal temperature: 300°C
Flow time: 3 seconds or less (per one pin),
Exposure limit^Note: None
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25°C and relative humidity at 65% or less.
Caution Do not apply more than a single process at once, except for “partial heating method”.
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