UPC1676B Datasheet, PDF (5/5 Pages) NEC – 1.2 GHz BANDWIDTH LOW NOISE SILICON MMIC AMPLIFIER

UPC1676B, UPC1676G, UPC1676P
OUTLINE DIMENSIONS
UPC1676P (CHIP)
(Units in µm)
4
5
1
2
3
CHIP FEATURES
• Die Size: 0.60 mm x 0.65 mm
• Thickness: 170 ± 30 µm
• Pad Size: 100 µm x 100 µm
• Ti/Pt/Au Metallization
BONDING INFORMATION
BONDING
PAD NO.
1
2
3
4
5
BONDING PAD (mm)
X AXIS
-185
-5
+185
+185
-175
Y AXIS
210
-210
-210
-210
+210
PAD
CONNECTION
INPUT
GND
GND
OUTPUT
VCC
Note:
All dimensions are typical unless otherwise specified.
ORDERING INFORMATION
PART NUMBER
UPC1676G-T1
QTY
3000 / Reel
UPC1676B
PACKAGE OUTLINE B08
(Units in mm)
1.27±0.1 1.27±0.1
(LEADS 2, 4, 6, 8) 0.6
0.4 (LEADS 1, 3, 5, 7)
43 2
10.6 MAX
5
1
3.8±0.2
678
3.8±0.2
10.6 MAX
LEAD
CONNECTIONS
1. Input 5. Output
2. GND 6. GND
3. GND 7. VCC
4. GND 8. GND
1.7 MAX
0.2
+0.05
-0.02
UPC1676G
PACKAGE OUTLINE 39
(Units in mm)
+0.2
2.8 _-0.3
+0.2
1.5 _-0.1
+0.10
0.4 -0.05
(LEADS 2, 3, 4)
2.9 ± 0.2 0.95
2
0.85
3
1.9
1
4
+0.10
0.6 _-0.05
1.1+-00..21 _0.8
PIN
CONNECTIONS
1. GND
5˚
2. Output
3. VCC
4. Input
0.16
+0.10
-0.06
5˚
0 to 0.1
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
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DATA SUBJECT TO CHANGE WITHOUT NOTICE
PRINTED IN USA ON RECYCLED PAPER -3/97