UPD703037A Datasheet, PDF (49/52 Pages) NEC – V850/SB2TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS

µPD703037A, 703037AY, 70F3037A, 70F3037AY
Table 6-1. Surface Mounting Type Soldering Conditions (2/2)
µPD70F3037AGF-3BA: 100-pin plastic QFP (14 × 20)
µPD70F3037AYGF-3BA: 100-pin plastic QFP (14 × 20)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235 °C, Time: 30 seconds MAX. (at 210 °C or higher),
Count: Two times or less
Exposure limit: 3 days^Note (after that, prebake at 125 °C for 20 to 72 hours)
<Caution>
Non-heat-resistance trays, such as magazine and taping trays, cannot be baked
before unpacking.
IR35-203-2
VPS
Package peak temperature: 215 °C, Time: 25 to 40 seconds MAX. (at 200 °C or
higher), Count: Two times or less
Exposure limit: 3 days^Note (after that, prebake at 125 °C for 20 to 72 hours)
<Caution>
Non-heat-resistance trays, such as magazine and taping trays, cannot be baked
before unpacking.
VP15-203-2
Wave soldering
Solder bath temperature: 260 °C MAX., Time: 10 seconds MAX., Count: once
Preheating temperature: 120 °C MAX. (package surface temperature)
Exposure limit: 3 days^Note (after that, prebake at 125 °C for 20 to 72 hours)
WS60-203-1
Partial heating
Pin temperature: 300 °C MAX., Time: 3 seconds MAX. (per pin row)
–
Note After opening the dry pack, store it at 25 °C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet U14894EJ1V0DS00
49