UPD75P316A Datasheet, PDF (37/42 Pages) NEC – 4-BIT SINGLE-CHIP MICROCOMPUTER

µPD75P316A
7. RECOMMENDED SOLDERING CONDITIONS
The µPD75P316A should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document “Semiconductor Device
Mount Manual” (IEI-1207).
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 7-1 Surface Mounting Type Soldering Conditions
µPD75P316AGF-3B9 : 80-pin plastic QFP (14 × 20 mm)
Solderring Method
Solderring Conditions
Wave soldering
Infrared reflow
VPS
Pin part heating
Solder bath temperature: 260 °C or below. , Duration: 10 sec. max.
Number of times: Once, Time limit: 7 days*(thereafter 20 hours prebaking required
at 125 °C)
Package peak temperature: 230 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Once, Time limit: 7 days*(thereafter 20 hours prebaking required
at 125 °C)
Package peak temperature: 215 °C, Duration: 40 sec. max. (at 200 °C or above),
Number of times: Once, Time limit: 7 days* (thereafter 20 hours prebaking required
at 125 °C)
Pin part temperature: 300 °C or below , Duration: 3 sec. max. (per device side)
Recommended
Condition Symbol
WS60-207-1
IR30-207-1
VP15-207-1
–––
* For the storage period after dry-pack decapsulation, storage conditions are max. 25 °C, 65 % RH.
Note Use more than one soldering method should be avoided (except in the case of pin part heating).
For Your Information
Products to improve the recommended soldering conditions are available.
(Improvements : Extension of the infrared reflow peak temperature to 235 °C, doubled frequency, increased
life, etc.)
For further details, consult our sales personnel.
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