UPD75P316A Datasheet, PDF (20/42 Pages) NEC – 4-BIT SINGLE-CHIP MICROCOMPUTER

µPD75P316A
MAIN SYSTEM CLOCK OSCILLATOR CHARACTERISTICS (Ta = –40 to +85 °C, VDD = 2.7 to 6.0 V)
RESONATOR RECOMMENDED CIRCUIT
PARAMETER
TEST CONDITIONS MIN.
Ceramic
resonator
X1
X2
C1
C2
VDD
Oscillator frequency
(fX) *1
1.0
Oscillation stabilization
time *2
After VDD reaches the
minimum value in the
oscillation voltage
range
Crystal
resonator
Oscillator frequency
X1
X2
(fX) *1
1.0
C1
C2
VDD
Oscillation stabilization
time *2
VDD = 4.5 to 6.0 V
X1 input frequency
X1
X2
(fX) *1
1.0
External
clock
X1 high and low level
µPD74HCU04
widths (tXH, tXL)
100
TYP. MAX. UNIT
5.0*3 MHz
4
ms
4.19 5.0*3 MHz
10
ms
30
ms
5.0*3 MHz
500
ns
* 1. Oscillator characteristics only. Refer to the description of AC characteristics for details of instruction execution
time.
2. Time required for oscillation to become stabilized after VDD reaches MIN. of the oscillation voltage range or
after STOP mode release.
3. When the oscillator frequency is 4.19 MHz < fX ≤ 5.0 MHz, do not select PPC = 0011 as instruction execution
time. If PCC = 0011 is selected, 1 machine cycle becomes less than 0.95 µs, with the result that specified MIN.
value 0.95 µs can not be observed.
SUBSYSTEM CLOCK OSCILLATOR CHARACTERISTICS (Ta = –40 to +85 °C, VDD = 2.7 to 6.0 V)
RESONATOR RECOMMENDED CIRCUIT
PARAMETER
TEST CONDITIONS
Crystal
resonator
XT1 XT2
R
C3
C4
Oscillator frequency
(fXT)
VDD = 4.5 to 6.0 V
Oscillation stabilization
time*
VDD
MIN. TYP. MAX. UNIT
32 32.768 35
kHz
1.0
2
s
10
s
External
clock
X1
X2
XT1 input frequency
(fXT)
XT1 high and low level
widths (tXTH, tXTL)
32
100 kHz
5
15
µs
20