GCM188R71H333KA55D Datasheet, PDF (60/67 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C03E.pdf
May.17,2013
Notice
Continued from the preceding page.
2. Land Dimensions
2-1. Chip capacitors can be cracked due to the stress of
PCB bending, etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Chip Capacitor
c
Land
b
a
Solder Resist
Table 1 Flow Soldering Method
Part Number
Dimensions
Chip (LgW)
GC3/GCD/GCM/GCJ18
(Rated Voltage: above 250VDC (for GCJ18 alone))
1.6g0.8
GC3/GCD/GCM/GCJ21
(Rated Voltage: above 250VDC (for GCJ21 alone))
2.0g1.25
GC3/GCD/GCM/GCJ31
(Rated Voltage: above 250VDC (for GCJ31 alone))
3.2g1.6
Flow soldering can only be used for products with a chip size of 3.2x1.6mm or less.
a
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
b
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
c
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
(in mm)
Table 2 Reflow Soldering Method
Part Number
Dimensions
GC3/GCD/GCE/GCJ/GCM03
GC3/GCD/GCE/GCJ/GCM15
GC3/GCD/GCE/GCJ/GCM18
GC3/GCD/GCE/GCJ/GCM21
GC3/GCD/GCE/GCJ/GCM31
GC3/GCD/GCE/GCJ/GCM32
GC3/GCD/GCE/GCJ/GCM43
GC3/GCD/GCE/GCJ/GCM55
Chip (LgW)
0.6g0.3
1.0g0.5
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
4.5g3.2
5.7g5.0
a
0.2 to 0.3
0.3 to 0.5
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
b
0.2 to 0.35
0.35 to 0.45
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
1.2 to 1.4
1.4 to 1.6
c
0.2 to 0.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
(in mm)
<Applicable to Part Number KC3/KCM>
Part Number
Dimensions
Chip (LgW)
a
b
c
KC3/KCM55
5.7g5.0
2.6
2.7
5.6
(in mm)
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa s s (500ps) min. (at 25°C).
3. Adhesive Coverage
Size (LgW)
Adhesive Coverage*
1.6g0.8
0.05mg min.
2.0g1.25
0.1mg min.
3.2g1.6
0.15mg min.
*Nominal Value
58
Board
Chip Capacitor
Adhesive
Land
a=20 to 70μm
b=30 to 35μm
c=50 to 105μm
a
c
b
Continued on the following page.