GCM188R71H333KA55D Datasheet, PDF (56/67 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors for Automotive

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
Continued from the preceding page.
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
C03E.pdf
May.17,2013
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
6. Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when
inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the
pressure of a test pin, etc.
The thrusting force of the test probe can flex the PCB,
resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to
prevent warping or flexing.
1-2. Avoid vibration of the board by shock when a test pin
contacts a printed circuit board.
[Not Recommended]
[Recommended]
Peeling
Test-pin
Support Pin
Test-pin
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do
not apply any stress to the capacitor that is caused by
bending or twisting the board.
1-1. In cropping the board, the stress as shown at right
may cause the capacitor to crack.
Avoid this type of stress to a capacitor.
[Bending]
[Twisting]
Continued on the following page.
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