GCM32ER71C226KE19L Datasheet, PDF (55/67 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors for automotive

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C03E.pdf
May.17,2013
Continued from the preceding page.
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions
(the "Temperature of the Soldering Iron Tip," "Preheating
Temperature," and "Temperature Differential" between
the iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces (ΔT) as low as possible.
2. After soldering, do not allow the component/PCB to cool
down rapidly.
3. The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, resulting in a reduction in the
adhesive strength of the terminations.
4. Optimum solder amount when re-working with a soldering
iron
4-1. In the case of sizes smaller than 0603, (GC3/GCD/
GCE/GCJ/GCM Series, 03/15/18 sizes), the top of
the solder fillet should be lower than ²/₃ of the
thickness of the component or 0.5mm, whichever is
smaller. In the case of 0805 and larger sizes, (GC3/
GCD/GCE/GCJ/GCM Series, 21/31/32/43/55 sizes),
the top of the solder fillet should be lower than ²/₃ of
the thickness of the component. If the solder amount
is excessive, the risk of cracking is higher during
board bending or under any other stressful condition.
4-2. A soldering iron with a tip of ø3mm or smaller should
be used. It is also necessary to keep the soldering
iron from touching the components during the re-work.
4-3. Solder wire with ø0.5mm or smaller is required for
soldering.
<Applicable to KC3/KCM Series>
5. For the shape of the soldering iron tip, refer to the figure
on the right.
Regarding the type of solder, use a wire diameter of
ø0.5mm or less (rosin core wire solder).
How to Apply the Soldering Iron
Apply the tip of the soldering iron against the lower end of
the metal terminal.
1) In order to prevent cracking caused by sudden heating of
the ceramic device, do not touch the ceramic base directly.
2) In order to prevent deviations and dislocating of the chip,
do not touch the junction of the chip and the metal
terminal, and the metal portion on the outside directly.
!Caution
Table 3
Part Number
Temperature
of Soldering
Iron Tip
Preheating
Temperature
Temperature
Differential
(ΔT)
Atmosphere
GC3/GCD/GCE/
GCJ/GCM Series 350°C max. 150°C min. ΔTV190°C Air
03/15/18/21/31 sizes
GCJ/GCM Series
32/43/55 sizes
280°C max. 150°C min. ΔTV130°C
Air
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Solder Amount
in section
17
26
R0.5
Tip of Soldering Iron
Tip temperature: 350°C or less/
5 sec. or less/60W or less
(in mm)
Copper Land
Wire Solder
Apply the tip of the soldering iron only
on the terminal portion, without touching
the body of the chip.
Appropriate Amount of Solder
The amount of solder for corrections by soldering iron,
should be lower than the height of the lower side of the chip.
Cross Section
Continued on the following page.
53