GCM32ER71C226KE19L Datasheet, PDF (53/67 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors for automotive

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C03E.pdf
May.17,2013
Continued from the preceding page.
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solder ability of tin plating termination chips might be
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of tin is used. Please confirm the solder ability of tin
plated termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in table 1.
Table 1
Part Number
GC3/GCD/GCE/GCJ/GCM Series
03/15/18/21/31 sizes
GCJ/GCM Series 32/43/55 sizes
KC3/KCM Series 55 size
Temperature Differential
ΔTV190°C
ΔTV130°C
Recommended Conditions
Pb-Sn Solder
Reflow
Vapor Reflow
Lead Free
Solder
Peak Temperature 230 to 250°C 230 to 240°C 240 to 260°C
Atmosphere
Saturated vapor
Air
of inactive solvent ^{Air or N2}
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
!Caution
[Standard Conditions for Reflow Soldering]
Reflow
Temperature (°C)
Peak Temperature
220°C (200°C)
ΔT
190°C (170°C)
170°C (150°C)
150°C (130°C)
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 30-60 seconds
Temperature
Incase of Lead Free Solder
( ): In case of Pb-Sn Solder
Vapor Reflow
Temperature (°C)
Peak Temperature
ΔT
190°C (170°C)
170°C (150°C)
150°C (130°C)
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 20 seconds max.
[Allowable Reflow Soldering Temperature and Time]
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to
the end surface to a height of 0.2mm* min.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
∗ _{GRM03: 1/3 of Chip Thickness min.}
0.2mm^∗ min.
in section
Continued on the following page.
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