RGLD8X103J Datasheet, PDF (15/19 Pages) Murata Manufacturing Co., Ltd. – SIP Resistor Network

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Performance and Test Method
N16E9.pdf 01.11.26
Test Item
Performance
DC Resistance value Within the specified Value
Test Method
Based on JIS C 5202 5.1. Maximum applied voltage is shown in the table below.
Nominal Resistance Range(Ω)
1100VRF100
1100VRF1k
111kVRF10k
110kVRF100k
100kVRF1M
100kVRU1M
Max. Applied Voltage (V)
00.3
01
03
10
25
50
Temperature
Coefficient of
Resistance
Within T200ppm/D
Based on JIS C 5202 5.2. Measure after maintaining for over 30 minutes at each stage
shown in the table below, Calculation shall be made with the formula shown below.
Stage
1
2
3
4
Temp.°C
Y20T⁵¹
Y55T3
Y20T⁵¹
125T3
Remarks
Standard temp. on low-temp. side
Standard temp. on high-temp. side
R : Actual measured resistance value(Ω) at t D
R0 : Actual measured resistance value(Ω) at t0 D
t : Actual measured value of test temperature (D)
t0 : Actual measured value of standard temperature (D)
TCR(ppm/D)=
RYR0
R0
Z
1
tYt0
Z10⁶
Short Time Overload
No noticeable abnormalities in
appearance.
∆R : Within T1.0%
Pull Test
Bend Test
There shall be no broken or loose
pins.
Resistance to
Soldering Heat
Solderability
There shall be neither mechanical
damage nor noticeable change in
appearance.
∆R : Within T0.5%
Over 95% of the immersed part of
the pins is covered with new
solder.
Temperature
Cycling
There shall be no mechanical
damage.
∆R : Within T0.5%
Apply 2.5 times the rated voltage for 5 seconds to each resistor in the network, one at a time.
Maintain at room temperature for 30 minutes after remove the voltage, then measure.
Fix the sample body and apply a load of 10N gradually to the pin in the axial direction.
Maintain the force for 10 seconds.
Bend the pin by 90° in the vertical direction and return to the previous position under applying
a load of 5N. And repeat a similar operation in the opposite direction.
Immerse the pin in melted solder at 260T5D up to the level of the seating plane of pin for
10T1 second and raise. Then maintain at room temperature for over 1 hour and measure.
Immerse the pin in a flux comprising methanol and resin (weight ratio 25%) up to the level of
the seating plane of pin for 5Y10seconds. Then, immerse in melted solder at 235T5D for
2T0.5 second and raise slowly.
Based on JIS C 5202 7.4 After repeating the 5 cycles shown in the table below, maintain at
room temperature for 1Y2 hours, then measure.
Stage
Temp.(D)
Time (min.)
1
Y55T3
30
2
Room Temp.
2 to 3
3
125T2
30
4
Room Temp.
2 to 3
Humidity
Humidity Load
Load Life
There shall be no noticeable
abnormalities in appearance.
∆R : Within T2.0%
There shall be no noticeable
abnormalities in appearance.
∆R : Within T2.0%
There shall be no noticeable
abnormalities in appearance.
∆R : Within T2.0%
Maintain without load at a constant temperature 40T2D and constant humidity of 90Y95% for
1000T⁴⁸⁰ hours. Remove and maintain at room temperature for over 1 hour, then measure.
Apply the rated voltage intermittently, 1.5 hours on and 0.5 hours off in a chamber at a
constant temperature of 40T2D and constant humidity of 90Y95% for 1000T⁴⁸⁰ hours.
Remove and maintain at room temperature for over 1 hour, then measure.
Apply the rated voltage intermittently, 1.5 hours on and 0.5 hours off in a high-temperature
chamber at 70T3D for 1000T⁴⁸⁰ hours. Remove and maintain at room temperature for over 1
hour, then measure.
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