NB669 Datasheet, PDF (2/19 Pages) Monolithic Power Systems – 24V, High Current Synchronous Buck Converter With LDO

NB669, 24V, HIGH CURRENT SYNCHRONOUS BUCK CONVERTER WITH LDO
ORDERING INFORMATION
Part Number*
NB669GQ
Package
QFN16 (3mmx3mm)
Top Marking
AEV
* For Tape & Reel, add suffix –Z (e.g. NB669GQ–Z)
PACKAGE REFERENCE
TOP VIEW
AGND EN ENLDO VCC BST
14 13 12 11 10
VIN
1
PGND
2
15 SW
16 SW
9
SW
8
SW
3
4
5
6
7
NC PG
EXPOSED PAD
ON BACKSIDE
CLK
LDO VOUT
ABSOLUTE MAXIMUM RATINGS ⁽¹⁾
Supply Voltage V_IN ....................................... 24V
V_SW........................................-0.3V to V_IN + 0.3V
V_SW (30ns)................................... -3V to V_IN + 4V
V_SW (5ns)....................................... -6V to V_IN+4V
V_BST ................................................... V_SW + 5.5V
V_EN ............................................................... 12V
Enable Current I_EN(2)................................ 2.5mA
All Other Pins ...............................-0.3V to +5.5V
Continuous Power Dissipation (T_A=+25°C) ⁽³⁾
QFN16……………………..….…..…………1.8W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Recommended Operating Conditions ⁽⁴⁾
Supply Voltage V_IN........................... 6.5V to 22V
Output Voltage V_OUT ...................................... 5V
Enable Current I_EN...................................... 1mA
Operating Junction Temp. (T_J)..-40°C to +125°C
Thermal Resistance ⁽⁵⁾ θ_JA θ_JC
QFN16 (3mmx3mm) ............... 70 ...... 15... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) Refer to Page 11 of Configuring the EN Control.
3) The maximum allowable power dissipation is a function of the
maximum junction temperature T_J(MAX), the junction-to-
ambient thermal resistance θ_JA, and the ambient temperature
T_A. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P_D(MAX)=(T_J(MAX)-
T_A)/θ_JA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
4) The device is not guaranteed to function outside of its
operating conditions.
5) Measured on JESD51-7, 4-layer PCB.
NB669 Rev. 1.01
www.MonolithicPower.com
2
7/23/2013
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