MMBD1000LT1 Datasheet, PDF (5/8 Pages) Motorola, Inc – Switching Diode

MMBD1000LT1 MMBD2000T1 MMBD3000T1 MMSD1000T1
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
STEP 5
HEATING ^HEATING
ZONES 3 & 6 ^{ZONES 4 & 7}
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO
219°C
PEAK AT
SOLDER
JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 2. Typical Solder Heating Profile
Motorola Small–Signal Transistors, FETs and Diodes Device Data
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