MC54-74HC366 Datasheet, PDF (5/5 Pages) Motorola, Inc – Hex 3-State Inverting Buffer with Common Enables

MC54/74HC366
–A
–
16
1
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
ISSUE V
9
–B
–
8
C
L
–T
SEAT–ING
PLANE
F
N
K
E
G
D 16 PL
0.25 (0.010) M T A S
M
J 16 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C
— 0.200 — 5.08
D 0.015 0.020 0.39 0.50
E
0.050 BSC
1.27 BSC
F 0.055 0.065 1.40 1.65
G
0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L
0.300 BSC
7.62 BSC
M
0° 15° 0°
15°
N 0.020 0.040 0.51 1.01
–A
–
16
1
H
G
9
B
8
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
F
C
L
S
–T
–
SEATING
PLANE
K
J
M
D 16 PL
0.25 (0.010) ^M T A ^M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.070 1.02 1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M
0° 10°
0° 10°
S 0.020 0.040 0.51 1.01
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High–Speed CMOS Logic Data
DL129 — Rev 6
◊ ^CODELINE
*MC54/74HC366/D* ^{MC54/74HC366/D}
5
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