MC33997 Datasheet, PDF (5/20 Pages) Motorola, Inc – Switching Power Supply with Linear Regulators

Freescale Semiconductor, Inc.
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Main Supply Voltage
V_PWR
-0.3 to 45
V
Keep-Alive Supply Voltage
KA_V_PWR
-0.3 to 45
V
Switching Node
V_SW
-0.5 to 45
V
5.0 V Input Power
V_DDH
-0.3 to 6.0
V
Sensor Supply
V_REF1
V_REF2
-0.3 to 18
V
-0.3 to 18
Keep-Alive Supply Voltage
V_KAM
-0.3 to 6.0
V
Maximum Voltage at Logic I/O Pins
EN
SNSEN
PWROK
VKAMOK
-0.3 to 6.0
V
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
Charge Pump Reservoir Capacitor Voltage
C_RES
-0.3 to 18
V
Error Amplifier Summing Node
V_SUM
-0.3 to 6.0
V
Switching Regulator Output Feedback
FBKB
-0.3 to 6.0
V
V_DDL Base Drive
DRVL
-0.3 to 6.0
V
V_DDL Feedback
FBL
-0.3 to 6.0
V
ESD Voltage
Human Body Model (all pins) (Note 1)
Machine Model (all pins) (Note 2)
V_ESD1
V_ESD2
V
±500
±100
Power Dissipation (T_A = 25°C) (Note 3)
P_D
800
mW
Thermal Resistance, Junction to Ambient (Note 4), (Note 5)
R_θJ-A
60
°C/W
Thermal Resistance, Junction to Board (Note 6)
R_θJ-B
20
°C/W
Operational Package Temperature [Ambient Temperature] (Note 7)
T_A
-40 to 125
°C
Operational Junction Temperature
T_J
-40 to 150
°C
Storage Temperature
T_STG
-55 to 150
°C
Lead Soldering Temperature (Note 8)
T_S
260
°C
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP=100 pF, R_ZAP=1500 Ω).
2. ESD2 testing is performed in accordance with the Machine Model (C_ZAP=200 pF, R_ZAP=0 Ω)
3. Maximum power dissipation at indicated junction temperature.
4. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
5. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
7. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
8. Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
MOTOROLA ANALOG INTEGRATED CIR_FC_oUI_rT_MDE_oV_rIC_eE_ID_nA_foTA_{rmation On This Product,}
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33997
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