MRF5583 Datasheet, PDF (3/4 Pages) Motorola, Inc – SURFACE MOUNT HIGH-FREQUENCY TRANSISTOR PNP SILICON

PACKAGE DIMENSIONS
–T–
–A–
8
5
–B– ^{4X P}
1
4
0.25 (0.010) M B M
C
8X D
SEATING
K ^PLANE
0.25 (0.010) M T B S A S
R X 45 _{_}
M_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
F
J
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
EMITTER
COLLECTOR
COLLECTOR
EMITTER
EMITTER
BASE
BASE
EMITTER
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.196
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G
1.27 BSC
0.050 BSC
J 0.18 0.25 0.007 0.009
K 0.10 0.25 0.004 0.009
M 0_{_} 7_{_} 0_{_} 7_{_}
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
CASE 751–05
ISSUE M
MOTOROLA RF DEVICE DATA
MRF5583
3