MRF644 Datasheet, PDF (2/4 Pages) Motorola, Inc – RF POWER TRANSISTOR NPN SILICON

ELECTRICAL CHARACTERISTICS — continued (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
ON CHARACTERISTICS
DC Current Gain
(IC = 4.0 Adc, VCE = 5.0 Vdc)
DYNAMIC CHARACTERISTICS
hFE
40
70
100
—
Output Capacitance
(VCB = 12.5 Vdc, IE = 0, f = 1.0 MHz)
FUNCTIONAL TESTS
Cob
—
60
85
pF
Common–Emitter Amplifier Power Gain
Gpe
(VCC = 12.5 Vdc, Pout = 25 W, IC (MAX) = 3.6 Adc, f = 470 MHz)
Input Power
Pin
(VCC = 12.5 Vdc, Pout = 25 W, f = 470 MHz)
Collector Efficiency
η
(VCC = 12.5 Vdc, Pout = 25 W, IC (MAX) = 3.6 Adc, f = 470 MHz)
Output Mismatch Stress
ψ*
(VCC = 16 Vdc, Pin = Note 1, f = 470 MHz,
VSWR = 20:1, All Phase Angles)
6.2
7.0
—
dB
—
5.0
6.0
Watts
55
60
—
%
No Degradation in Output Power
Series Equivalent Input Impedance
(VCC = 12.5 Vdc, Pout = 25 W, f = 470 MHz)
Zin
—
1.2 + j3.3
—
Ohms
Series Equivalent Output Impedance
(VCC = 12.5 Vdc, Pout = 25 W, f = 470 MHz)
ZOL
—
1.9 + j2.1
—
Ohms
NOTE:
1. Pin = 150% of Drive Requirement for 25 W Output at 12.5 Vdc.
* ψ = Mismatch stress factor — the electrical criterion established to verify the device resistance to load mismatch failure. The mismatch stress
test is accomplished in the standard test fixture (Figure 1) terminated in a 20:1 minimum load mismatch at all phase angles.
RFC1
B
C10
L1
Z1
Z2
Z3
C1
C2
SOCKET
C4
C6
C11
C12 C13
B
L2
Z4
C3
Z5
D.U.T.
C5
Z6
Z7
C7
C14
Z8
Z9
C9
C8
C1, C2, C7, C8 — 1.0 – 20 pF Johanson Variable
C3 — 27 pF 100 mil ATC
C4 — 30 pF 100 mil ATC
C5, C6 — 33 pF 100 mil ATC
C9 — 250 pF 100 mil ATC
C10 — 100 pF UNELCO
C11, C14 — 1.0 µF 35 V TANTALUM
C12, C13 — 680 pF Feedthrough
L1 — 5″ #22 AWG 0.100″ ID
L2 — 5″ #20 AWG 0.187″ ID
RFC1 — Ferroxcube VK200–20–4B
B — Ferroxcube Bead 56–590–65–3B
Z1 — 0.25″ x 0.20″ Microstrip
Z2 — 1.63″ x 0.20″ Microstrip
Figure 1. Test Circuit Schematic
Z3 — 0.20″ x 0.20″ Microstrip
Z4, Z5 — 1/2″ #18 AWG bent in a
Z4, Z5 — “V” shape 1/8″ Wide
Z6 — 0.20″ x 0.20″ Microstrip
Z7 — 0.70″ x 0.20″ Microstrip
Z8 — 0.33″ x 0.20″ Microstrip
Z9 — 0.50″ x 0.20″ Microstrip
Board — 62.5 mil Glass Teflon, ε_r = 2.55
MRF644
2
MOTOROLA RF DEVICE DATA