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2N6240 Datasheet, PDF (2/4 Pages) Motorola, Inc – Silicon controlled Rectifiers Reverse Blocking Triode Thyristors | |||
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2N6240
MAXIMUM RATINGS â continued (TJ = 25°C unless otherwise noted.)
Rating
Symbol
Value
Unit
*Average Gate Power
(t = 8.3 ms, TC = 90°C)
Peak Forward Gate Current
Peak Reverse Gate Voltage
*Operating Junction Temperature Range
*Storage Temperature Range
Mounting Torque(1)
THERMAL CHARACTERISTICS
PG(AV)
IGM
VRGM
TJ
Tstg

0.1
0.2
6
â40 to +110
â40 to +150
6
Watt
Amp
Volts
°C
°C
in. lb.
Characteristic
Symbol
Min Max
Unit
*Thermal Resistance, Junction to Case
RθJC
Thermal Resistance, Junction to Ambient
RθJA
*Indicates JEDEC Registered Data.
ELECTRICAL CHARACTERISTICS (TC = 25°C and RGK = 1000 ohms unless otherwise noted.)
Characteristic
Symbol
Min
â
3
â
75
Typ
°C/W
°C/W
Max
Unit
* Peak Forward or Reverse Blocking Current
(VAK = Rated VDRM or VRRM) TC = 25°C
TC = 110°C
*Peak Forward âOnâ Voltage
(ITM = 8.2 A Peak, Pulse Width = 1 to 2 ms, 2% Duty Cycle)
Gate Trigger Current (Continuous dc)(2)
(VAK = 12 Vdc, RL = 24 Ohms)
*(VAK = 12 Vdc, RL = 24 Ohms, TC = â40°C)
Gate Trigger Voltage (Continuous dc)
(Source Voltage = 12 V, RS = 50 Ohms)
*(VAK = 12 Vdc, RL = 24 Ohms, TC = â40°C)
Gate NonâTrigger Voltage
(VAK = Rated VDRM, RL = 100 Ohms, TC = 110°C)
Holding Current
(VAK = 12 Vdc, IGT = 2 mA)
*(Initiating OnâState Current = 200 mA)
TC = 25°C
TC = â40°C
*Total TurnâOn Time
(Source Voltage = 12 V, RS = 6 k Ohms)
(ITM = 8.2 A, IGT = 2 mA, Rated VDRM)
(Rise Time = 20 ns, Pulse Width = 10 µs)
Forward Voltage Application Rate
(VD = Rated VDRM, TC = 110°C)
*Indicates JEDEC Registered Data.
IDRM, IRRM
â
â
10
µA
â
â
200
µA
VTM
â
â
2.2
Volts
IGT
VGT
µA
â
â
200
â
â
500
â
â
1
Volts
VGD
IH
tgt
0.2
â
â
Volts
mA
â
â
5
â
â
10
â
2
â
µs
dv/dt
â
10
â
V/µs
1. Torque rating applies with use of compression washer (B52200F006 or equivalent). Mounting torque in excess of 6 in. lb. does not appreciably
lower case-to-sink thermal resistance. Anode lead and heatsink contact pad are common. (See ANâ209 B)
For soldering purposes (either terminal connection or device mounting), soldering temperatures shall not exceed +200°C. For optimum
results an activated flux (oxide removing) is recommended.
2. Measurement does not include RGK current.
2
Motorola Thyristor Device Data
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