MC33364 Datasheet, PDF (12/14 Pages) ON Semiconductor – Critical Conduction GreenLine SMPS Controller

MC33364
A
D
OUTLINE DIMENSIONS
D1, D2 SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE S
C
8
E
1
5
H
4
0.25 M B M
B
e
h X 45 _{_}
q
C
A
SEATING
PLANE
L
0.10
A1
B
0.25 M C B S A S
D SUFFIX
PLASTIC PACKAGE
CASE 751B–05
(SO–16)
–A–
ISSUE J
16
9
–B– P 8 PL
1
8
0.25 (0.010) M B S
G
–T– SEATING
PLANE
K
C
D 16 PL
0.25 (0.010) M T B S A S
F
R X 45_{_}
M
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 1.35 1.75
A1 0.10 0.25
B 0.35 0.49
C 0.18 0.25
D 4.80 5.00
E 3.80 4.00
e
1.27 BSC
H 5.80 6.20
h 0.25 0.50
L 0.40 1.25
q
0_{_} 7_{_}
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G
1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
12
MOTOROLA ANALOG IC DEVICE DATA