MC33186 Datasheet, PDF (11/12 Pages) Motorola, Inc – Automotive H-Bridge Driver

MC33186
Freescal_Pe_ACS_KAe_Gm_{E IN}i_Fc_Oo_Rn_MAd_Tu_IOc_N tor, Inc.
The HSOP20 package is designed for enhanced thermal
performance. The particularity of this package is its copper
baseplate on which the power die is soldered. The baseplate
is soldered on a PCB to provide heat flow to the ambient and
also to provide a large thermal capacitance.
Of course, the more copper area on the PCB, the better
the power dissipation and transient behaviour.
We characterized the HSOP20 on a double side PCB. The
bottom side area of the copper is 7.8 cm². The top surface is
2.7 cm², see Figure 22.
Figure 22. PCB Test Layout
Figure 23. PHSOP20 Thermal Response
100
10
Rth (°C/W)
1
0,1
0,001
0,01
0,1
1
10
t, Time (s)
100
1000
10000
Figure 23 shows the thermal response with the device
soldered on to the test PCB described on figure 22.
Top Side
Bottom Side
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MC33186
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