PS21313 Datasheet, PDF (5/9 Pages) Mitsubishi Electric Semiconductor – TRANSFER-MOLD TYPE INSULATED TYPE

MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21313
TRANSFER-MOLD TYPE
INSULATED TYPE
MECHANICAL CHARACTERISTICS AND RATINGS
Parameter
Mounting torque
Weight
Heat-sink flatness
Condition
Mounting screw : M3
Recommended 8kg·cm
Recommended 0.78N·m
(Note 5)
RECOMMENDED OPERATION CONDITIONS
Symbol
Parameter
Condition
VCC
Supply voltage
VD
Control supply voltage
VDB
Control supply voltage
∆VD, ∆VDB Control supply variation
tdead
Arm shoot-through blocking time
fPWM
PWM input frequency
VCIN(ON) _{Input ON voltage}
VCIN(OFF) _{Input OFF voltage}
Applied between P-N
Applied between VP1-VNC, VN1-VNC
Applied between VUFB-VUFS, VVFB-VVFS, VWFB-VWFS
For each input signal
Tj ≤ 125°C, Tf ≤ 100°C
Applied between UP, VP, WP-VNC
Applied between UN, VN, WN-VNC
Limits
Unit
Min.
Typ. Max.
—
8
— kg·cm
—
0.78
—
N·m
—
20
—
g
–50
—
100
µm
Limits
Min.
Typ.
Max.
0
300
400
13.5 15.0 16.5
13.5 15.0 16.5
–1
—
1.0
3
—
—
—
15
—
0~0.65
4.0~5.5
Unit
V
V
V
V/µs
µs
kHz
V
V
Note 5:
+–
Heat-sink
Measurement Range
DIP-IPM
3mm
–
+
Heat-sink
Aug. 1999